u个人简介
杨栋华,副教授,硕士生导师.
2008.09-2012.01,获得北京科技大学材料学工学博士学位;
2012.04-2014.07,清华大学博士后研究;
2014.09至今,重庆理工大学bet365365备用网站教师.
在国内外重要刊物如Acta Materialia、Journal of Materials Science: Materials in Electronics、Journal of Electronic Materials等刊物上发表学术论文20余篇，申请并授权发明专利10余项。
u研究领域
微电子封装材料及可靠性，材料表面和界面
u承担的主要项目
[1] 3D封装微小焊点界面金属间化合物的生长取向与其性能关联规律研究，重庆市基础与前沿研究一般项目, 2016.7-2019.6,5万,主持.
[2] 温度梯度诱导全CoSn3金属间化合物微互连焊点的生长行为及可靠性研究，重庆市教委科学技术研究项目, 2016.7-2019.6,5万,主持.
[3] 材料的组织控制及其分析测试, 横向项目, 2015.7-2016.12,7万,主持.
[4] 大长径比身管的加工模拟及性能研究,横向项目, 2014.12-2015.12,5万,主持.
[5] BGA封装中Sn-Ag(-Cu)/Co焊点的界面反应及可靠性,中国博士后面上基金,2013.09-2014.07,5万,主持.
[6] 微型热电器件封装用新型非晶薄膜的扩散阻挡机制研究,重庆市重点产业共性关键技术创新专项(一般), 2016.1-2017.12,主持.
[7] 高热流密度下低银SAC微焊点加速热疲劳研究,国家自然科学基金,2018.1-2020.12, 60万,参与.
[8]同步低温原位合成7075铝基复合材料半固态浆料及其流变成形机制研究,国家自然科学基金(青年基金), 2016.1-2018.12,25万,参与.
u代表性成果
[1] Lu N, Yang D, Li L. Interfacial reaction between Sn–Ag–Cu solder and Co–P films with various microstructures[J]. Acta Materialia, 2013, 61(12): 4581-4590.
[2] Yang D, Cai J, Wang Q, et al. IMC growth and shear strength of Sn–Ag–Cu/Co–P ball grid array solder joints under thermal cycling[J]. Journal of Materials Science: Materials in Electronics, 2015, 26(2): 962-969.
[3] Yang D, Yang G, Li L. Microstructure and morphology of interfacial intermetallic compound CoSn3 in Sn–Pb/Co–P solder joints[J]. Microelectronics Reliability, 2015, 55(11): 2403-2411.
[4] Li S, Yang D, Tan Q, et al. Evaluation of Electroplated Co-P Film as Diffusion Barrier Between In-48Sn Solder and SiC-Dispersed Bi2Te3 Thermoelectric Material[J]. Journal of Electronic Materials, 2015, 44(6): 2007-2014.
[5] Yang D, Yang G, Cai J, et al. Kinetics of interfacial reaction between Sn-3.0Ag-0.5Cu solder and Co-4.0P or Co-8.0P metallization: 2015 16th International Conference on Electronic Packaging Technology (ICEPT), 2015.
[6] Yang D, Lu N, Li L. Wettability of Sn-Bi and Sn-Ag-Cu lead-free solder pastes on electroplated Co-P films: 63rd Electronic Components and Technology Conference (ECTC), 2013.
[7] Yang D, Yang G, Cai J, et al. Reliability of Sn-Pb solder joints with Cu and Co-P surface finishes under thermal cycling: 2014 15th International Conference on Electronic Packaging Technology (ICEPT), 2014.
u联系方式
E-mail：yangdonghua@cqut.edu.cn